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| CXG1027TM Driver Amplifier for Transmission Description The CXG1027TM is a two-stage driver amplifier for 800 MHz and 1.5 GHz PDC. This is used to amplify the transmission-side power of the RF signal. Features * Ultraminiature package (10 pin TSSOP) * Low voltage operation : 2.9 V (Min.) * Low current consumption : 45 mA (Typ.) * High gain : 27.5 dB (Typ.) (for 1.5 GHz) 29.5 dB (Typ.) (for 800 MHz) * Low distortion (Adjacent channel leak power ratio) : -50 dBc (Typ.) (30 kHz offset) -69 dBc (Typ.) (50 kHz offset) * Positive power supply operation (Adjustment-free for VGG) * Supports both 800 MHz and 1.5 GHz by the external matching circuit Applications Power amplification between the quadrature modulator IC for 800 MHz/1.5 GHz PDC transmitter (approx. -15 dBm output) and the power module or power amplifier MMIC (approx. +10 dBm input) Structure GaAs MMIC 10 pin TSSOP (Plastic) Absolute Maximum Ratings (Ta=25 C) * Supply voltage VDD 6 * Operating temperature Topr -35 to +85 * Storage temperature Tstg -65 to +150 * Allowable power dissipation PD 550 * Voltage between gate and source VGSO 15 * Drain current 150 Operating Condition Supply voltage VDD VGG V C C mW V mA 3.4 0.2 V V Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. --1-- E97223-TE CXG1027TM Electrical Characteristics VGG=0.2 V, VDD=3.4 V, f=941.5 MHz Item 1 Current consumption Output power 1 Power gain 2 Adjacent channel leak power ratio (30 kHz offset) 2 Adjacent channel leak power ratio (50 kHz offset) Symbol IDD POUT GP ACPR30 ACPR50 Min. 10 27 Typ. 45 29.5 -50 -69 Max. 65 32 -47 -65 (Ta=25 C) Unit mA dBm dB dBc dBc VGG=0.2 V, VDD=3.4 V, f=1.441 GHz Item 1 Current consumption Output power 1 Power gain 2 Adjacent channel leak power ratio (30 kHz offset) 2 Adjacent channel leak power ratio (50 kHz offset) 1 : When +10 dBm output Symbol IDD POUT GP ACPR30 ACPR50 Min. 10 25 Typ. 45 27.5 -50 -69 Max. 65 30 -47 -65 (Ta=25 C) Unit mA dBm dB dBc dBc 2 : When +10 dBm output, 21 kHz band width Block Diagram Package Description/Pin Configuration 1 VDD1 GND GND (CAP) RFOUT/VDD2 RFIN RFOUT/VDD2 VDD1 VGG GND 10pin TSSOP (PLASTIC) 10 GND GND (CAP) RFIN VGG GND (1.5GHz) or GND (IND) (800MHz) --2-- CXG1027TM Recommended Circuit (For 800 MHz) Cp 1000pF 1 10 R1 15 Cp 1000pF 2 C2 10pF RFOUT L4 12nH 9 C1 100pF L1 33nH RFIN L2 39nH 3 8 4 Cp 1000pF R2 12 VDD Cp 1000pF L3 8.2nH 7 VGG 5 6 L5 5.6nH Cp 1000pF (For 1.5 GHz) Cp 1000pF 1 10 R1 15 Cp 1000pF 2 C2 4pF RFOUT L4 4.7nH 9 C1 100pF L1 18nH RFIN L2 18nH 3 8 4 Cp 1000pF R2 12 VDD Cp 1000pF L3 10nH 7 VGG 5 6 Cp 1000pF --3-- CXG1027TM Recommended Evaluation Board (For 800 MHz) 25mm VGG GND VDD L3 R2 Cp L5 Cp Cp RFIN L1 L2 C1 L4 C2 R1 Cp Cp RFOUT GND (For 1.5 GHz) VGG GND VDD L3 R2 Cp Cp Cp RFIN L1 L2 C1 Cp L4 C2 RFOUT R1 Cp GND Glass fabric-base epoxy 4-layer board (Thickness : 0.3 mm x 2) GND for the overall 2nd, 3rd and 4th sides --4-- CXG1027TM Example of Representative Characteristics (Ta=25 C) POUT, Gain, IDD, ACPR vs. PIN Freq.=1.441GHz, VDD=3.4V, VGG=0.2V 30 Gain 20 -20 -30 POUT [dBm] Gain [dB] 10 POUT 60 ACPR30 -40 0 ACPR50 -50 -10 IDD -20 -40 -30 IDD [mA] 50 -60 -20 -10 PIN [dBm] 0 40 -70 POUT, Gain, IDD, ACPR vs. VDD Freq.=1.441GHz, VGG=0.2V, PIN=-18dBm 30 Gain 20 -30 -20 10 -40 0 ACPR30 60 -50 -10 IDD ACPR50 50 IDD [mA] -60 -20 2.0 2.5 3.0 3.5 4.0 VDD [V] 4.5 5.0 40 5.5 -70 Gain, ACPR vs. IDD Freq.=1.441GHz, POUT=10dBm, VDD=3.4V, VGG=var. 30 -20 Gain 20 -30 Gain [dB] 10 ACPR30 -40 0 -50 -10 ACPR50 -60 -20 20 30 40 50 IDD [mA] 60 70 80 -70 --5-- ACPR [dBc] ACPR [dBc] POUT [dBm] Gain [dB] POUT ACPR [dBc] CXG1027TM Package Outline Unit : mm 10PIN TSSOP(PLASTIC) 1.2MAX 2.8 0.1 10 6 0.1 2.2 0.1 + 0.15 0.1 - 0.05 3.2 0.2 1 5 0.5 0.25 0 to 10 0.22 0.1 M (0.2) + 0.08 0.22 - 0.07 DETAIL A NOTE: "" Dimensions do not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-10P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g --6-- (0.1) + 0.025 0.12 - 0.015 A 0.45 0.15 |
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